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JTX Swap Board CPU Chip Reballing Platform for iPhone 8-16 Pro Max Option:SM-02 Plug-in box

USD33.99 USD59.99

Pay in 4 interest-free payments of $8.50 Learn more

Shipping Estimate
USA
  • USA
  • CAN

Ships within 48 hours · Estimated delivery Sep 13 - Sep 18

Notes

Hard rule
Description

Plug-in box

Take apart screen cover 180℃-220℃

effective adsorption of smoke and harmful gases

Cb(blue) offset

Check "Enable OEM unlock" option

JTX Swap Board CPU Chip Reballing Platform for iPhone 8-16 Pro Max Option:SM-02 Plug-in boxJTX SM 01 Swap Master 30 in 1 Tinning Platform with BGA stencil for iPhone 8 16 Pro Max motherboard replacement and CPU BGA chip reballing. Super Magnetic Positioning Tinning Platform for iPhone PCB board swapping chips rapid positioning, allows for reballing of multiple chip sizes at once, and the strong magnetism aids the reballing process, ensuring optimal solder component placement. Option: 1. SM 01: For iPhone 8 8P X Qualcomm. 2. SM 02: For

Exchange/Return Notes
  • We offer a 30-day return/exchange service after receiving.
  • Final sale items are not eligible for returns or exchanges.
  • To process your return/exchange, please contact us at [email protected]
  • Please click here for more details>>> Return & Exchange Policy

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