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YCS M.Y CPU/Middle Layer Reballing Platform for iPhone X-17 Pro Max Option:M.Y CPU Reballing kit (X-17PM ) Package Size/Weight: 409*287*197mm/7

USD45.99 USD87.99

Pay in 4 interest-free payments of $11.50 Learn more

Shipping Estimate
USA
  • USA
  • CAN

Ships within 48 hours · Estimated delivery Sep 11 - Sep 16

Notes

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Description

Package Size/Weight: 409*287*197mm/7

Full-featured false detection protection

Suitable for heating mobile phone screen and back cover

Multiple interfaces available: USB HOST DEVICE

1pcs x Temperature Probe

YCS M.Y CPU/Middle Layer Reballing Platform for iPhone X-17 Pro Max Option:M.Y CPU Reballing kit (X-17PM ) Package Size/Weight: 409*287*197mm/7YCS MR. YANG BGA Reballing Stencil with Platform Kit for iPhone X 17 Pro Max middle layer and A11 A19 Pro CPU soldering repair. The reballing soldering kit includes various stencils designed for replacing and resoldering different circuit boards. It safely and effectively resolders iPhone CPU or mid frame solder joints, helping to repair iPhone malfunctions caused by solder joint issues. The BGA reballing platform kit supports repairs of mid layer

Exchange/Return Notes
  • We offer a 30-day return/exchange service after receiving.
  • Final sale items are not eligible for returns or exchanges.
  • To process your return/exchange, please contact us at [email protected]
  • Please click here for more details>>> Return & Exchange Policy

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